发明名称 THERMOPLASTIC RESIN COMPOSITION FOR INSULATION COMPONENTS, AND INSULATION COMPONENT
摘要 <p>Provided are: a thermoplastic resin composition for insulation components, which is capable of achieving strength characteristic equivalent to or higher than the GWIT 775°C standard in almost all test piece thicknesses for insulation components without requiring blending of a special ingredient that is a liquid crystalline polymer or use of a glass fiber at high blending ratio, while having good balance among the strength characteristic, tracking resistance and mechanical characteristics; and an insulating component which uses the thermoplastic resin composition for insulation components. The thermoplastic resin composition for insulation components is characterized by containing (A) a polybutylene terephthalate resin, (B) a halogen flame retardant, (C) a flame retardant assistant, (D) a mineral filler having a moisture content of 20% by mass or more and a dehydration initiation temperature of 300°C or more and (E) a glass fiber-based reinforcing agent, and is also characterized in that the component (B) is contained in an amount of 15-35 parts by mass per 100 parts by mass of the component (A) and the component (D) is contained in an amount of 2-60 parts by mass per 100 parts by mass of the component (A).</p>
申请公布号 WO2013061622(A1) 申请公布日期 2013.05.02
申请号 WO2012JP53185 申请日期 2012.02.10
申请人 PANASONIC CORPORATION;SAWANO, SHIN;SHIMODA, DAISUKE 发明人 SAWANO, SHIN;SHIMODA, DAISUKE
分类号 H01B3/42;C08K3/38;C08K5/3492;C08K7/14;C08L67/02;H01B17/56 主分类号 H01B3/42
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