PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having good resistance to electroless gold plating and excellent filling property into a through hole, from which a cured product where a defect in the outer appearance of a cured film caused by bumping in a through hole is inhibited can be obtained; a cured film of the photosensitive resin composition; and a printed circuit board comprising the cured film.

SOLUTION: A photosensitive resin composition comprises (A) a photosensitive carboxylic acid resin and (B) a liquid bifunctional epoxy resin and is characterized by comprising (C) an aluminum-containing inorganic filler in an amount of not less than 200 parts by mass with respect to 100 parts by mass of total carboxylic acid resin.

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