| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that allows preventing breakage of a wire. <P>SOLUTION: A semiconductor device 101 includes a semiconductor chip 200, an island portion 320 on which the semiconductor chip 200 is mounted, a lead 310 having a terminal portion 350, and a resin package 400. The lead 300 further has a coupling portion 330 that couples the island portion 320 to the terminal portion 350, and a wire bonding portion 340 that is connected to a position spaced apart from the coupling portion 330 with respect to the terminal portion 350 and approaches inside the resin package 400 from the terminal portion 350 side. The semiconductor chip 200 and the wire bonding portion 340 are connected by a wire 500. <P>COPYRIGHT: (C)2013,JPO&INPIT |
