| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module which improves the ease of making a connection between bus bars and main electrode terminals, and to provide an arrangement structure of the semiconductor module. <P>SOLUTION: A semiconductor module 1 includes: a semiconductor body part 2, which has a planar shape and has plate surfaces 21 at both sides which function as cooling surfaces cooled by coolers; and multiple main electrode terminals 3 which are led out from one side surface 22A at the semiconductor body part 2 and to which bus bars 4, having electrical continuity with an electric power source, are connected. The multiple main electrode terminals 3 are disposed so as to be aligned in the long side direction of the one side surface 22A, and connection surfaces 321, each of which faces the bus bar 4, are formed perpendicular to the plate surfaces 21 at the semiconductor body part 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
