发明名称 LASER BEAM MACHINING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To uniform the intensity of laser beams on a substrate in the length direction or the width direction of beams by simple processing. <P>SOLUTION: The laser beam machining apparatus includes a laser oscillator 11; a table 1 on which a glass substrate is placed; a first aspherical cylindrical lens 14 controlling the width of beams in a direction orthogonal to a scribe predetermined line; a second aspherical cylindrical lens 15 controlling the length of beams; a cooling nozzle 3; and a table drive mechanism 4 for scanning the laser beams and the cooling nozzle 3. The first and second aspherical cylindrical lenses 14, 15 uniform the intensity distribution of incident laser beams having gauss type intensity distribution, in the beam width and length directions on the glass substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013078780(A) 申请公布日期 2013.05.02
申请号 JP20110219810 申请日期 2011.10.04
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 HAYASHI NAOHISA;SHIMIZU SEIJI
分类号 B23K26/073;B23K26/00;B23K26/06;C03B33/09 主分类号 B23K26/073
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