| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit module that allows high-density wiring by providing auxiliary wiring not connected to an integrated circuit element for an IC package having the integrated circuit element. <P>SOLUTION: A circuit module includes an IC package 2 having an integrated circuit element 5 and a wiring board 3 on which the IC package 2 is mounted, and the integrated circuit element 5 is connected to a plurality of land electrodes of the wiring board 3 via a part of a plurality of pads formed on a surface of the IC package 2. At least the two pads not connected to the integrated circuit element 5 among the plurality of pads are provided on the IC package 2, and they are connected by auxiliary wiring 8 not connected to the integrated circuit element 5. Further, a plurality of wiring patterns 10 provided in the wiring board 3 are connected via at least the two pads not connected to the integrated circuit element 5 and the auxiliary wiring 8. <P>COPYRIGHT: (C)2013,JPO&INPIT |
