CURABLE RESIN COMPOSITION, CURABLE RESIN COMPOSITION TABLET, MOLDED PRODUCT, PACKAGE FOR SEMICONDUCTOR, SEMICONDUCTOR PART AND LIGHT-EMITTING DIODE

摘要

PROBLEM TO BE SOLVED: To provide a curable resin composition which gives a cured product having a low linear expansion coefficient.

SOLUTION: The curable resin composition includes, as necessary components: (A) an organic compound having at least two carbon-carbon double bonds, reactive with a SiH group, in a molecule; (B) a compound containing at least two SiH groups in a molecule; (C) a hydrosilylation catalyst; (D) a silicone compound having at least one carbon-carbon double bonds, reactive with a SiH group, in a molecule; (E) an inorganic filler; and (F) a black pigment; wherein the warpage of a package is in the range of ±1.00 mm when the composition is molded on one surface of a lead frame for a light-emitting diode.

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