发明名称 |
WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY BONDING ARRANGEMENT, AND THIN WAFER MANUFACTURING METHOD |
摘要 |
A wafer processing laminate is provided comprising a support, a temporary adhesive layer on the support, and a wafer laid on the temporary adhesive layer. The temporary adhesive layer has a trilayer structure consisting of a first bond layer (A) of thermoplastic organosiloxane polymer which is releasably bonded to the circuit-forming front surface of the wafer, a second bond layer (B) of thermosetting modified siloxane polymer which is laid on the first bond layer, and a third bond layer (A') of thermoplastic organosiloxane polymer which is laid on the second bond layer and releasably bonded to the support. |
申请公布号 |
US2013108866(A1) |
申请公布日期 |
2013.05.02 |
申请号 |
US201213659168 |
申请日期 |
2012.10.24 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD.;SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
KATO HIDETO;SUGO MICHIHIRO;TAGAMI SHOHEI |
分类号 |
C09J7/02;B32B7/12;B32B9/04;B32B27/38;B32B38/10 |
主分类号 |
C09J7/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|