发明名称 THIN-FILM SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THIN-FILM SEMICONDUCTOR DEVICE
摘要 A thin-film semiconductor device includes a semiconductor device part and a capacitor part. The semiconductor device part includes: a light-transmitting first gate electrode; a light-shielding second gate electrode; a first insulating layer; a semiconductor layer; a second insulating layer; and a source electrode and a drain electrode. The capacitor part includes: a first capacitor electrode made of a light-transmitting conductive material; a dielectric layer; and a second capacitor electrode. The second gate electrode, the semiconductor layer, and the second insulating layer have outlines that are coincident with one another in a top view.
申请公布号 US2013105798(A1) 申请公布日期 2013.05.02
申请号 US201213710969 申请日期 2012.12.11
申请人 PANASONIC CORPORATION;PANASONIC CORPORATION 发明人 KANEGAE ARINOBU;KAWASHIMA TAKAHIRO
分类号 H01L27/04;H01L21/77 主分类号 H01L27/04
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