| 发明名称 |
ELECTRONIC DEVICE PACKAGES AND METHODS |
| 摘要 |
Electronic devices are described which are adapted and configured to incorporate a fingerprint sensor within a recess or aperture, formed or molded in the housing, such that the fingerprint sensor interface is within 500 microns of an exterior surface of the device. Methods of use and manufacture are also described. |
| 申请公布号 |
US2013108124(A1) |
申请公布日期 |
2013.05.02 |
| 申请号 |
US201213657959 |
申请日期 |
2012.10.23 |
| 申请人 |
WICKBOLDT PAUL;THAMMASOUK KHAMVONG |
发明人 |
WICKBOLDT PAUL;THAMMASOUK KHAMVONG |
| 分类号 |
H05K5/00;G06K9/62;H05K13/00 |
主分类号 |
H05K5/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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