发明名称 THIN FILM SEMICONDUCTOR DEVICE
摘要 <p>A thin film semiconductor device (100) is provided with a gate electrode (120), a channel layer (140), a first amorphous semiconductor layer (150), a channel protection layer (160), a pair of second amorphous semiconductor layers (171, 172) formed on both side surfaces of the channel layer (140), and a pair of contact layers (181, 182) that comes into contact with the side surfaces of the channel layer (140) with the second amorphous semiconductor layers (171, 172) therebetween, wherein: the gate electrode (120), the channel layer (140), the fist amorphous semiconductor layer (150), and the channel protection layer (160) are laminated in a manner such that the contours thereof overlap when viewed from above; the local energy level density of the first amorphous semiconductor layer (150) is higher than the local energy level densities of the second amorphous semiconductor layers (171, 172); and the band gaps of the second amorphous semiconductor layers (171, 172) are greater than the band gap of the first amorphous semiconductor layer (150).</p>
申请公布号 WO2013061574(A1) 申请公布日期 2013.05.02
申请号 WO2012JP06771 申请日期 2012.10.23
申请人 PANASONIC CORPORATION 发明人 KANEGAE, ARINOBU;KAWASHIMA, TAKAHIRO
分类号 H01L29/786;H01L21/20;H01L21/336;H01L51/50 主分类号 H01L29/786
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