| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a no-flow underfill material which allows easy production of reliable and soldered and sealed interconnection in electric parts. <P>SOLUTION: A curable flux composition is provided, which includes, as initial components: a resin component having at least two oxirane groups per molecule; a carboxylic acid; a fluxing agent represented by formula (I) ; and optionally, a curing agent. In formula, R<SP POS="POST">1</SP>, R<SP POS="POST">2</SP>, R<SP POS="POST">3</SP>and R<SP POS="POST">4</SP>are each independently selected from hydrogen etc., and zero to three of R<SP POS="POST">1</SP>, R<SP POS="POST">2</SP>, R<SP POS="POST">3</SP>and R<SP POS="POST">4</SP>is (are) hydrogen. A method of soldering an electrical contact using the curable flux composition is also provided. <P>COPYRIGHT: (C)2013,JPO&INPIT |
