LAMINATE AND METHOD FOR PRODUCING COMPONENT FOR POWER SEMICONDUCTOR MODULES

摘要

Provided is a laminate wherein an insulating layer has high thermal conductivity and the insulating layer exhibits high adhesion to a conductive layer. A laminate (1) of the present invention comprises: a heat conductive body (2) that has a thermal conductivity of 10 W/m·K or more; a first insulating layer (3) that is arranged on the surface of the heat conductive body (2); and a second insulating layer (4) that is arranged on the surface of the first insulating layer (3). The laminate (1) is used with a conductive layer that is arranged on the second insulating layer (4). The first insulating layer (3) contains an inorganic filler that has a thermal conductivity of 10 W/m·K or more in an amount of 86% by weight or more but less than 97% by weight, and the second insulating layer (4) contains an inorganic filler in an amount of 67% by weight or more but less than 95% by weight. The curing ratio of the first insulating layer (3) is 50% or more, the curing ratio of the second insulating layer (4) is less than 80%, and the curing ratio of the first insulating layer (3) is larger than the curing ratio of the second insulating layer (4).