ADHESIVE TAPE FOR PROCESSING SEMICONDUCTOR DEVICE

摘要

The purpose of the present invention is to provide an adhesive tape whereby dicing can be performed by preventing cut dust from adhering to semiconductor devices without implementing extra improvement of equipment and introducing extra consumables in semiconductor device processing. An adhesive tape (1) of the present invention is to be used for the purpose of fixing batch-encapsulated packages at the time of dividing the batch-encapsulated packages into individual packages by dicing the batch-encapsulated packages into individual packages. The adhesive tape has an ultraviolet curable adhesive layer (5) on a base material film (3), and the surface of the adhesive layer (5) prior to ultraviolet irradiation has a contact angle of 115° or less with respect to pure water, and a contact angle of 65° of less with respect to methylene iodine.