| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sample surface inspection method and a sample surface inspection apparatus which achieve high accuracy by controlling a sample surface voltage while considering charge-up of a sample. <P>SOLUTION: When secondary electrons B2 obtained by irradiating a wafer W with primary electrons emitted from an electron gun 1 are mapped and projected on a detector 41 by a secondary optical system 3, a voltage of the wafer W and a retarding voltage are changed in accordance with a dose of the primary electrons. During inspection of a pattern, a stage is moved in synchronization with an operating frequency of the detector 41, and the speed of the stage is accelerated when the stage is moved in order to inspect another pattern on the sample. <P>COPYRIGHT: (C)2013,JPO&INPIT |
