| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for scribing a mother substrate which suppresses defects such as "chipping", "splitting" and "intersection skipping" when a substrate is cleaved. <P>SOLUTION: The method for scribing a mother substrate comprises: (a) a step of forming on the mother substrate a lateral first scribe line which sections the lower side of a strip substrate to be cut out, by scribing along a first horizontal scribe scheduled line of the mother substrate; (b) a step of forming lengthwise second and third scribe lines which form the substantial right and left sides of unit products in the strip substrate, respectively, by scribing in the lengthwise direction by the same number as the number of the unit products up to a second horizontal scribe scheduled line set in a position forming the surface of the strip substrate; and (c) a step of forming a lateral fourth scribe line which sections the upper side of the surface of the strip substrate, by scribing along a second lateral scribe scheduled line. <P>COPYRIGHT: (C)2013,JPO&INPIT |
