发明名称 |
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE |
摘要 |
The present invention provides a dicing tape-integrated film for semiconductor back surface, including: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface has a storage elastic modulus (at 60° C.) of from 0.9 MPa to 15 MPa.
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申请公布号 |
US2013108847(A1) |
申请公布日期 |
2013.05.02 |
申请号 |
US201213725278 |
申请日期 |
2012.12.21 |
申请人 |
NITTO DENKO CORPORATION;NITTO DENKO CORPORATION |
发明人 |
HAYASHI MIKI;TAKAMOTO NAOHIDE |
分类号 |
H01L21/683 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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