发明名称 |
SEMICONDUCTOR COMPONENT HAVING A STACK OF SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING THE SAME |
摘要 |
A semiconductor component including a stack of semiconductor chips, the semiconductor chips being fixed cohesively one on top of another, is disclosed. The contact areas of the semiconductor chips are led as far as the edges of the semiconductor chips and conductor portions extend at least from an upper edge to a lower edge of the edge sides of the semiconductor chips in order to electrically connect the contact area of the stacked semiconductor chips to one another.
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申请公布号 |
US2013105992(A1) |
申请公布日期 |
2013.05.02 |
申请号 |
US201213721957 |
申请日期 |
2012.12.20 |
申请人 |
INFINEON TECHNOLOGIES AG;INFINEON TECHNOLOGIES AG |
发明人 |
BAUER MICHAEL;ENGLING THOMAS;HALMERL ALFRED;KESSLER ANGELA;MAHLER JOACHIM;SCHOBER WOLFGANG |
分类号 |
H01L23/538;H01L25/065 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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