| 摘要 |
A panel for forming a floor covering includes a substrate and a top layer, and is provided with coupling means defined at the edges. The substrate at the respective edges defines a profile, and a moisture-repellent or sealing covering layer is provided on the profiles. The covering layer extends over the profiles at least up to a lateral surface of the top layer. The covering layer, at least at one of the edges, is at least partially provided in an undercut performed in the lateral surface.
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