| 发明名称 |
RESIN COMPOSITION |
| 摘要 |
A resin composition for obtaining a cured resin material exhibiting improved heat resistance and a higher glass transition temperature is disclosed. The resin composition contains a resin selected from a) a thermosetting resin and a curing agent, or b) a thermoplastic resin, and an inorganic filler with an average particle diameter of 1000 nm or less.
|
| 申请公布号 |
US2013105929(A1) |
申请公布日期 |
2013.05.02 |
| 申请号 |
US201313738153 |
申请日期 |
2013.01.10 |
| 申请人 |
FUJI ELECTRIC CO., LTD.;FUJI ELECTRIC CO., LTD. |
发明人 |
GANBE TATSUYA;TAKEMATSU YUJI;OKAMOTO KENJI |
| 分类号 |
C08K3/36;H01L21/56;H01L23/29;H01L31/0203 |
主分类号 |
C08K3/36 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
