| 摘要 |
<P>PROBLEM TO BE SOLVED: To accurately measure the position of an electronic component mounted by an electronic component mounting device. <P>SOLUTION: An image of a calibration mark 33, which is provided on an inspection substrate PP and comprises a plurality of recognition marks 34, is captured by a substrate recognition camera 19 and then subjected to recognition processing, thereby obtaining parameters for a magnification and an inclination of the inspection substrate PP. Further, an image of an electronic component mounted on the inspection substrate PP is captured by the substrate recognition camera 19 to recognize a mounting position, thereby correcting the position of the mounted electronic component on the basis of the parameters. <P>COPYRIGHT: (C)2013,JPO&INPIT |
