APPARATUS FOR MANUFACTURING IC CHIP PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing an IC chip package which implements improved packaging precision by precisely mounting an IC chip on an antenna circuit on a film.

SOLUTION: The apparatus for manufacturing an IC chip package includes: detection means 12 for detecting a unit rotation of a support roller 33 by observing an outer circumferential surface of the support roller 33; indexing means 13 for indexing an error corresponding to the detected unit rotation by means of a function related to a rotation error from a normal rotation of the support roller 33; rotation determination means 14 for determining an actual rotation of a rotational movement of the observed position on the outer circumferential surface of the support roller 33 observed by the detection means 12 to an IC chip mounting position, from the normal rotation of the rotational movement of the observed position on the outer circumferential surface of the support roller 33 to the IC chip mounting position and the error indexed by the indexing means 13; and rotation control means 15 for controlling the rotation of a synchronous roller 31 on the basis of the actual rotation determined by the rotation determination means 14.

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