| 摘要 |
An apparatus which includes first and second circuit boards, with respective electrodes thereon, in a bonded configuration, one or more first layers positioned to be proximal to the electrodes, electrolyte proximal to the respective electrodes, and one or more second layers. The second layers are configured to provide for the bonded configuration in which the first and second circuit boards are bonded together, under curing, such that the respective one or more first layers are positioned between the one or more second layers and the electrodes. The bonding defines a chamber between the second layers and the electrodes, with the electrodes therein and facing one another, and the chamber including the electrolyte. The one or more first layers are configured to inhibit the interaction of the electrolyte with the one or more second layers during curing.
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