| 摘要 |
PURPOSE: A semiconductor wafer and a method for fabricating a stack package using the same are provided to test a semiconductor chip on a wafer parallel to the lowermost semiconductor chip of a semiconductor chip module without applying a physical stress to the semiconductor chip module in a test. CONSTITUTION: A semiconductor chip includes a bonding pad(110) and a control module(120). The bonding pad is arranged along the central part of the semiconductor chip. The control module transfers a test signal on a connection line(300) to the bonding pad. The control module includes a storage part(121), a comparison part(122), and a switching part(123). The connection line is formed between scribe lanes in order to couple adjacent semiconductor chips. [Reference numerals] (121) Storage part; (122) Comparison part; (123) Switching part
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