| 发明名称 |
Interposers, electronic modules, and methods for forming the same |
| 摘要 |
In various embodiments, an electronic module features a first cavity in a first side of a substrate, a fill hole extending from the first cavity, and a second cavity in a second side of the substrate. The second cavity is in fluidic communication with the fill hole, and a die is encapsulated within the second cavity. |
| 申请公布号 |
AU2011312010(A1) |
申请公布日期 |
2013.05.02 |
| 申请号 |
AU20110312010 |
申请日期 |
2011.10.06 |
| 申请人 |
THE CHARLES STARK DRAPER LABORATORY, INC. |
发明人 |
THOMPSON, JEFFREY C.;RACZ, LIVIA M.;TEPOLT, GARY B.;LANGDO, THOMAS A.;MUELLER, ANDREW J. |
| 分类号 |
H01L23/538;H01L23/13;H05K1/18 |
主分类号 |
H01L23/538 |
| 代理机构 |
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| 主权项 |
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