| 摘要 |
A suction unit 10 includes a main body portion having a first surface 13 on which a semiconductor wafer W formed with a semiconductor device D is arranged and a second surface 14 that is a surface opposite to the first surface 13, and in which a through-hole 15 that penetrates through the first surface 13 and the second surface 14 is formed and a light transmitting portion having a light incident surface 16 onto which light from the semiconductor device D is made incident and a light emitting surface 17 from which light made incident from the light incident surface 16 is emitted, and which is fitted to the through-hole 15. Further, in the first surface 13, a first suction groove 13a for vacuum sucking the semiconductor wafer W to fix the semiconductor device D to the light incident surface 16 is formed, and in the second surface 14, a second suction groove 14a for vacuum sucking the solid immersion lens S to fix the solid immersion lens S to the light emitting surface 17 is formed. |
