| 摘要 |
<p>The invention relates to an optoelectronic component comprising a semiconductor chip (1) and a substrate (12), which is connected to the semiconductor chip (1) by means of a connecting layer (14) made of a metal or a metal alloy. The semiconductor chip (1) has electrical connection regions (18, 19) facing the substrate (12), and the substrate (12) comprise electrical rear-side contacts (28, 29) on a rear side remote from the semiconductor chip (1). Each of the rear-side contacts (28, 29) is electrically conductively connected to the first electrical or second connection region (18, 19) by means of at least one through-plating (15) that runs through the substrate (12), wherein the first and/or the second electrical rear-side contact (28, 29) are connected to the first or the second electrical connection region (18, 19) by means of at least one further through-plating (15, 16) that runs through the substrate. Furthermore, the invention relates to an advantageous method for producing such an optoelectronic component.</p> |
