ASYMMETRIC DIELECTRIC FILMS AND PROCESS FOR FORMING SUCH A FILM
摘要
<p>Cross-linked polymeric films suitable for use as a dielectric build-up layer in multi-layer chip carriers are provided. The films are suitable for use in any application using films that are dimensionally stable to temperature changes.</p>
申请公布号
EP2204079(B1)
申请公布日期
2013.05.01
申请号
EP20080843006
申请日期
2008.10.23
申请人
E. I. DU PONT DE NEMOURS AND COMPANY
发明人
INNOCENZO, JEFFREY, GLENN;LIN, PUI-YAN;OLIVER, RICHARD, C.;RAJENDRAN, GOVINDASAMY, PARAMASIVAM;ZAHR, GEORGE, ELIAS
