发明名称 Method for encapsulation of an electronic assembly
摘要 The method comprises applying an adhesive mass (5) based on partially crystalline polyolefin on and/or to the area of an optoelectronic arrangement (1) to be encapsulated, where the polyolefin has a density of 0.86-0.87 g/cm 3> and/or a crystalline melting point of 135[deg] C. The adhesive mass is provided in the form of an adhesive tape. The adhesive mass and/or the area of the optoelectronic arrangement to be encapsulated is heated before, during and/or after the application of the adhesive mass. The adhesive mass is crosslinked after the application. The method comprises applying an adhesive mass (5) based on partially crystalline polyolefin on and/or to the area of an optoelectronic arrangement (1) to be encapsulated, where the polyolefin has a density of 0.86-0.87 g/cm 3> and/or a crystalline melting point of 135[deg] C. The adhesive mass is provided in the form of an adhesive tape. The adhesive mass and/or the area of the optoelectronic arrangement to be encapsulated is heated before, during and/or after the application of the adhesive mass. The adhesive mass is crosslinked after the application. The application of the adhesive mass is carried out without subsequent hardening. The polyolefin is combined with an adhesive resin, where the quantity of the adhesive resin is 200-240 phr. The adhesive mass consists of a hydrogenated resin with a hydrogenation ratio of 95%, additives, and fillers such as nanoscale fillers, transparent fillers and/or getter- and/or scavenger filler. The additive is softener, primary antioxidants, secondary antioxidants, process stabilizer, light stabilizers, processing agents, UV-blocker and/or polymers. The adhesive mass is transparent and has a transmission grade of 90%. The adhesive mass is formed as UV-blocking in a wavelength range of 190-400 nm, where an average transmission grade of the UV blocker is 1%. The adhesive mass has a water vapor transmission rate of 40 g/m 2>.d and/or an oxygen transmission rate of 5000 g/m 2>.d.bar. The adhesive mass is formed as carrier-free adhesive tape. An independent claim is included for an electronic arrangement with organic electronic structure.
申请公布号 EP2200105(B1) 申请公布日期 2013.05.01
申请号 EP20090177827 申请日期 2009.12.03
申请人 TESA SE 发明人 KEITE-TELGENBUESCHER, DR. KLAUS;MUESSIG, DR. BERNHARD;ELLINGER, JAN;METZLER, KERSTIN
分类号 H01L51/52;H01L51/10;H01L51/44 主分类号 H01L51/52
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