发明名称 Haptic feedback module
摘要 <p>The present invention is directed to a haptic feedback module, which includes a vibration plate, and at least one first actuator that is disposed along a lateral surface of the perimeter of the vibration plate. The vibration plate makes contact with a top plate member. When the first actuator presses the vibration plate, the vibration energy of the vibration plate is transferred to the top plate member to result in haptic feedback.</p>
申请公布号 EP2587344(A1) 申请公布日期 2013.05.01
申请号 EP20110192284 申请日期 2011.12.07
申请人 CHIEF LAND ELECTRONIC CO. LTD. 发明人 CHUANG, TSI-YU;CHING, CHIA-NAN
分类号 G06F3/01 主分类号 G06F3/01
代理机构 代理人
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