| 摘要 |
In order to provide a high-frequency module allowing the pitch of connection terminals to be freely decreased without an adverse effect on downsizing. In a high-frequency module, mounting lands (30, 31, 32 and 39) arranged to mount at least one filter device having at least one set of an unbalanced terminal and two balanced terminals are provided at one side of a substrate top surface (12a), and a mounting land (34) arranged to mount at least one element electrically connected to the filter device are arranged at the opposite side. At least two of a plurality of connection terminals (referred to as "specific connection terminals") (22a and 22b, 23a and 23b, 24a and 24b, 25a and 25b) provided on a substrate bottom surface (12b) are respectively connected to conductor patterns (24) connected to via-hole conductors penetrating the substrate within a mounting area for mounting the filter device via connection lines (23) and are arranged at a pitch P which is less than the pitch of the via-hole conductors. |
