发明名称 CERAMIC RADIATION HEAT DISSIPATION STRUCTURE
摘要 <p>A ceramic radiation heat dissipation structure for heat dissipation from a heat source includes a ceramic substrate, a first radiation heat dissipation film and a porous heat dissipation plate. One surface of the ceramic substrate is attached to the heat source and the other surface of the ceramic substrate is provided with a first radiation heat dissipation film. The porous heat dissipation plate is attached to the first radiation heat dissipation film. The porous heat dissipation plate has at least one heat dissipation hole, and an inner sidewall of the at least one heat dissipation hole is provided with a second radiation heat dissipation film. The heat generated by the heat source is fast propagated outwards because of the high efficiency of thermal radiation provided by the first and second radiation heat dissipation films.</p>
申请公布号 EP2587535(A1) 申请公布日期 2013.05.01
申请号 EP20110797551 申请日期 2011.05.21
申请人 JINGDEZHEN FARED TECHNOLOGY CO., LTD 发明人 CHEN, JEONG-SHIUN
分类号 H01L23/36 主分类号 H01L23/36
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