发明名称 |
Multi-layer polishing pad material for CMP |
摘要 |
The invention is directed to a polishing pad for chemical-mechanical polishing comprising an optically transmissive multi-layer polishing pad material, wherein the optically transmissive polishing pad material comprises two or more layers that are joined together without the use of an adhesive. |
申请公布号 |
EP2025469(B1) |
申请公布日期 |
2013.05.01 |
申请号 |
EP20080017326 |
申请日期 |
2004.06.03 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
LACY, MICHAEL, S.;PRASAD, ABANESHWAR;SEVILLA, ROLAND, K. |
分类号 |
B24B49/12;B24B7/30;B24B37/04;B24B37/20;B24D3/32;B24D13/14 |
主分类号 |
B24B49/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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