| 摘要 |
PURPOSE: A resin composition is provided to obtain same or higher level with electrical, thermal, and mechanical properties required for existing printed circuit board and to reduce weight and size of a printed circuit board. CONSTITUTION: A resin composition for a printed circuit board comprises 100.0 parts by weight of a liquid crystal oligomer which includes a structure unit represented by chemical formula 1 and a structure unit represented by chemical formula 2, and includes a functional group represented by chemical formula 2, in at least one end of the structure unit; and 10-40 parts by weight of a rubber-modified epoxy resin. The number average molecular weight of the liquid crystal oligomer is 500-10,000 g/mol. The printed circuit board comprises an insulating layer(11,12,13) and a circuit pattern formed on the insulating layer. The insulating layer is formed of the resin composition. |
