发明名称 |
METHOD OF MITIGATING SUBSTRATE DAMAGE DURING DEPOSITION PROCESSES |
摘要 |
<p>Systems, methods, and apparatus for depositing a protective layer on a wafer substrate are disclosed. In one aspect, a protective layer is deposited over a surface of a wafer substrate using a process configured to produce substantially less damage in the wafer substrate than a first plasma-assisted deposition process. The protective layer is less than about 100 Angstroms thick. A barrier layer is deposited over the protective layer using the first plasma-assisted deposition process.</p> |
申请公布号 |
SG188656(A1) |
申请公布日期 |
2013.04.30 |
申请号 |
SG20130022702 |
申请日期 |
2011.09.21 |
申请人 |
NOVELLUS SYSTEMS, INC. |
发明人 |
WU, HUI-JUNG;SONG, KAY;LU, VICTOR;PARK, KIE-JIN;YAU, WAI-FAN |
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