| 发明名称 |
Integrated circuit including bond wire directly bonded to pad |
| 摘要 |
An integrated circuit includes a chip including a copper bond pad metallization, and a copper bond wire including a copper ball. The copper ball is bonded directly to the copper bond pad.
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| 申请公布号 |
US8432024(B2) |
申请公布日期 |
2013.04.30 |
| 申请号 |
US20100768134 |
申请日期 |
2010.04.27 |
| 申请人 |
SCHNEEGANS MANFRED;KOENIG LOTHAR;INFINEON TECHNOLOGIES AG |
发明人 |
SCHNEEGANS MANFRED;KOENIG LOTHAR |
| 分类号 |
H01L23/495;H01L21/44;H01L21/48;H01L21/50;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/495 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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