发明名称 Methods of manufacturing semiconductor devices
摘要 A method of manufacturing a semiconductor device includes forming a gate structure on a substrate; forming a sacrificial spacer may be formed on a sidewall of the gate substrate; implanting first impurities into portions of the substrate by a first ion implantation process using the gate structure and the sacrificial spacer as ion implantation masks to form source and drain regions; removing the sacrificial spacer; and implanting second impurities and carbon atoms into portions of the substrate by a second ion implantation process using the gate structure as an ion implantation mask to form source and drain extension regions and carbon doping regions, respectively.
申请公布号 US8431462(B2) 申请公布日期 2013.04.30
申请号 US201113183630 申请日期 2011.07.15
申请人 LEE KWAN-HEUM;JUNG SOON-WOOK;PARK JUNG-HYUN;KIM WOOK-JE;BAN JONG-SANG;SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE KWAN-HEUM;JUNG SOON-WOOK;PARK JUNG-HYUN;KIM WOOK-JE;BAN JONG-SANG
分类号 H01L21/337;H01L21/336;H01L21/8238;H01L27/12 主分类号 H01L21/337
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