发明名称 |
Circuit board and method of manufacturing the same |
摘要 |
Provided are a circuit board and a method of manufacturing the same. The method includes: forming a pad portion and a lead line portion of a metal on an insulating substrate, wherein the lead line portion is connected to the pad portion; forming a conductive layer on the pad portion and the lead line portion, wherein the conductive layer has an upper surface comprising gold; forming an etching mask on the conductive layer so as to expose a portion corresponding to the lead line portion in the conductive layer; etching a portion of the lead line portion exposed by the etching mask and a portion of the conductive layer corresponding to the lead line portion using an etching solution containing an acid; and removing the etching mask. |
申请公布号 |
US8431029(B2) |
申请公布日期 |
2013.04.30 |
申请号 |
US20090492382 |
申请日期 |
2009.06.26 |
申请人 |
KWON YOUNG-DUCK;KIM DEOK-HEUNG;SAMSUNG TECHWIN CO., LTD. |
发明人 |
KWON YOUNG-DUCK;KIM DEOK-HEUNG |
分类号 |
H01B13/00 |
主分类号 |
H01B13/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|