发明名称 |
Heat dissipation device having heat sink enclosing conductive member therein |
摘要 |
A heat dissipation device includes a base, a first heat sink mounted over the base and connected to the base via two first heat pipes, and a second heat sink located at a lateral side of the first heat sink and thermally connected to the base via a second heat pipe. The first heat sink includes two fin groups. One of the fin groups is stacked on the other fin group. Each of the fin groups includes a plurality of fins spreading radially from a center of the fin group to a periphery of the fin group along horizontal directions. |
申请公布号 |
US8430153(B2) |
申请公布日期 |
2013.04.30 |
申请号 |
US20090643931 |
申请日期 |
2009.12.21 |
申请人 |
XU SHOU-BIAO;CHEN GUO;ZHOU SHI-WEN;CHEN CHUN-CHI;FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. |
发明人 |
XU SHOU-BIAO;CHEN GUO;ZHOU SHI-WEN;CHEN CHUN-CHI |
分类号 |
F28F7/00;F28D15/00 |
主分类号 |
F28F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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