发明名称 Three dimensional multilayer circuit
摘要 A method for forming three-dimensional multilayer circuit includes forming an area distributed CMOS layer configured to selectively address a set of first vias and a set of second vias. A template is then aligned with the first set of vias and lower crossbar segments are created using the template. The template is then removed, rotated, and aligned with the set of second vias. Upper crossbar segments which attach to the second set of vias are then created.
申请公布号 US8431474(B2) 申请公布日期 2013.04.30
申请号 US20090567537 申请日期 2009.09.25
申请人 XIA QIANGFEI;WU WEI;HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 XIA QIANGFEI;WU WEI
分类号 H01L21/44 主分类号 H01L21/44
代理机构 代理人
主权项
地址