MULTI-CHIP PACKAGE

摘要

PURPOSE: A multichip package is provided to rapidly discharge high heat to the outside by exposing the upper side of a support member from a molding member. CONSTITUTION: A plurality of semiconductor chips(120) are laminated on a package substrate with a step type. Conductive connection members(140) electrically connect the semiconductor chips to the package substrate. A support member(130) supports the semiconductor chips. A molding member(150) is formed on the upper side of the package substrate. The molding member covers the semiconductor chips, the conductive connection members, and the support member.