发明名称 Bonding method of base materials, and manufacturing method of image display apparatus
摘要 It arranges a bonding material between a pair of base materials having different heat capacities and in which a difference between thermal expansion coefficients thereof is within 10×10-7/° C.; and bonds the pair of the base materials by the bonding material, by irradiating electromagnetic wave to the bonding material to melt and then harden it, wherein a thermal expansion coefficient at part of the bonding material facing one of the pair of the base materials of which the heat capacity is smaller is smaller than a thermal expansion coefficient at part of the bonding material facing the other of the pair of the base materials of which the heat capacity is larger by a difference within 10×10-7/° C., thereby bonding the base materials of which a difference of thermal expansion coefficients is relatively small, as preventing breakage and crack from occurring and further suppressing a degree of warp.
申请公布号 US8429935(B2) 申请公布日期 2013.04.30
申请号 US20100879652 申请日期 2010.09.10
申请人 HASEGAWA MITSUTOSHI;MATSUMOTO MAMO;SAITO TOMOHIRO;CANON KABUSHIKI KAISHA 发明人 HASEGAWA MITSUTOSHI;MATSUMOTO MAMO;SAITO TOMOHIRO
分类号 C03B23/203 主分类号 C03B23/203
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