发明名称 Epoxy resin composition
摘要 An epoxy resin composition containing an epoxy resin and a thermal cationic polymerization initiator not only can reduce the amount of fluorine ions generated during thermal cationic polymerization to improve electrolytic corrosion resistance but also is excellent in low-temperature rapid curability. The epoxy resin composition uses a sulfonium borate complex represented by the formula (1) as the thermal cationic polymerization initiator. In the formula (1), R1 is an aralkyl group, and R2 is a lower alkyl group, provided that when R2 is a methyl group, R1 is not a benzyl group. X is a halogen atom, and n is an integer of 1 to 3.
申请公布号 US8431654(B2) 申请公布日期 2013.04.30
申请号 US20080451798 申请日期 2008.03.18
申请人 SONY CHEMICAL & INFORMATION DEVICE CORPORATION;SHINYA YOSHIHISA;YAMAMOTO JUN;AIZAKI RYOTA;HAYASHI NAOKI;KONISHI MISAO 发明人 SHINYA YOSHIHISA;YAMAMOTO JUN;AIZAKI RYOTA;HAYASHI NAOKI;KONISHI MISAO
分类号 C08G59/70;C07F5/02;C08L63/00;C08L63/02;C08L63/04 主分类号 C08G59/70
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