| 摘要 |
PHOTOSENSITIVE SILICONE RESIN COMPOSITIONProvided is a resin composition which gives a cured product of a photocurable resin having excellent crackresistance even when formed into a thick film, and capable of maintaining a low coefficient of linear thermal expansion, low thermal weight loss, and a low cure shrinkage. This photosensitive silicone resin composition comprises (A) a silica particle-containing10 condensation reaction product and (B) a photopolymerization initiator, and is characterized inthat the silica particle- containing condensation reaction product (A) is a condensation reaction product of a polysiloxane compound (a) comprising a hydrolytic15 condensation product of one or more silane compoundsrepresented by the following general formula (1): RI,IISiX141 (wherein Rl, n1 and X1 are defined in the claims) and/or the silane compound, and silica particles (b), and has a terminal structure Si-O-Y (wherein Y is20 defined in the claims) which satisfies the followingformula (2): 0 < [Si-O-SiR33]/([Si-O-R2] + [Si-O-SiR33])1 (wherein, R2 and 1-23 are defined in the claims), and has a photopolymerizable functional group.) |
