发明名称 |
Method for fabricating a shielded gate trench MOS with improved source pickup layout |
摘要 |
A method for fabricating a semiconductor device includes forming a plurality of trenches using a first mask. The trenches include source pickup trenches located in outside a termination area and between two adjacent active areas. First and second conductive regions separated by an intermediate dielectric region are formed using a second mask. A first electrical contact to the first conductive region and a second electrical contact to the second conductive region are formed using a third mask and forming a source metal region. Contacts to a gate metal region are formed using a fourth mask. A semiconductor device includes a source pickup contact located outside a termination region and outside an active region of the device.
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申请公布号 |
US8431457(B2) |
申请公布日期 |
2013.04.30 |
申请号 |
US20100722384 |
申请日期 |
2010.03.11 |
申请人 |
CHANG HONG;SU YI;LI WENJUN;WENG LIMIN;CHEN GARY;KIM JONGOH;CHEN JOHN;ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED |
发明人 |
CHANG HONG;SU YI;LI WENJUN;WENG LIMIN;CHEN GARY;KIM JONGOH;CHEN JOHN |
分类号 |
H01L21/027;H01L29/78 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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