发明名称 Composition for forming upper layer film for immersion exposure, upper layer film for immersion exposure, and method of forming photoresist pattern
摘要 The object of the invention is to provide a composition for forming an upper layer film for immersion exposure capable of forming an upper layer film effectively inhibited from developing defects through an immersion exposure process, such as a watermark defect and dissolution residue defect. Also provided are an upper layer film for immersion exposure and a method of forming a resist pattern. The composition for forming an upper layer film includes a resin ingredient and a solvent. The resin ingredient includes a resin (A) having at least one kind of repeating units selected among those represented by the formulae (1-1) to (1-3) and at least either of the two kinds of repeating units represented by the formulae (2-1) and (2-2). (1-1) (1-2) (1-3) (2-1) (2-2) [In the formulae, R1 represents hydrogen or methyl; R2 and R3 each represents methylene, linear or branched C2-6 alkylene, or alicyclic C4-12 alkylene; R4 represents hydrogen or methyl; and R5 represents a single bond, methylene, or linear or branched C2-6 alkylene.].
申请公布号 US8431332(B2) 申请公布日期 2013.04.30
申请号 US20080680200 申请日期 2008.09.10
申请人 KOUNO DAITA;SUGIE NORIHIKO;WAKAMATSU GOUJI;NATSUME NORIHIRO;NISHIMURA YUKIO;SUGIURA MAKOTO;JSR CORPORATION 发明人 KOUNO DAITA;SUGIE NORIHIKO;WAKAMATSU GOUJI;NATSUME NORIHIRO;NISHIMURA YUKIO;SUGIURA MAKOTO
分类号 G03F7/11;G03F7/09;G03F7/38 主分类号 G03F7/11
代理机构 代理人
主权项
地址