发明名称 |
CABINET WITH MODULES HAVING A THERMOSIPHON COOLER ARRANGEMENT |
摘要 |
The present invention relates to the cooling of electric and/or electronic components, in particular to an electric and/or electronic system (200) with a cabinet (400), which comprises a cabinet housing (406) comprising a first aperture for receiving a stream of cooling air. The cabinet housing (406) comprises a second aperture for releasing the cooling air thereafter in an operating state of the cabinet. At least two modules (102), each comprising a guiding structure with an inlet and an outlet are provided in the cabinet. The at least two modules (102) are arranged in the cabinet housing (406) such that a branch of the major portion of cooling air flowing through the first aperture of said cabinet housing (406) is enabled to flow into each module (102) via the inlet guided by the guiding structure through the dedicated module (102) to the outlet and thereafter through the second aperture out of the cabinet housing (406). |
申请公布号 |
CA2792199(A1) |
申请公布日期 |
2013.04.30 |
申请号 |
CA20122792199 |
申请日期 |
2012.10.09 |
申请人 |
ABB TECHNOLOGY AG |
发明人 |
COTTET, DIDIER;AGOSTINI, FRANCESCO;GRADINGER, THOMAS;VOGELI, ANDREAS |
分类号 |
H05K7/20;F25B9/00;F25B21/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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