发明名称 |
Packaging device for an electronic element and method for making the same |
摘要 |
A method for making a packaging device for an electronic element includes: preparing a ceramic frame body defined with a hollow space for receiving the electronic element therein; preparing a ceramic substrate having a copper layer formed thereon; etching the copper layer to form a predetermined copper pattern on an upper surface of the ceramic substrate; placing the ceramic frame body onto the upper surface of the ceramic substrate and in contact with the copper pattern; and heating the ceramic frame body and the ceramic substrate such that the copper pattern bonds the ceramic frame body to the ceramic substrate. A packaging device for an electronic element is also disclosed. |
申请公布号 |
US8431835(B2) |
申请公布日期 |
2013.04.30 |
申请号 |
US20100720310 |
申请日期 |
2010.03.09 |
申请人 |
CHIANG WEN-CHUNG;WU KENG-CHUNG;HSIEH YING-CHI;LU CHENG-KANG;FU MING-HUANG;HIGH CONDUCTION SCIENTIFIC CO. LTD. |
发明人 |
CHIANG WEN-CHUNG;WU KENG-CHUNG;HSIEH YING-CHI;LU CHENG-KANG;FU MING-HUANG |
分类号 |
H01R13/502 |
主分类号 |
H01R13/502 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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