发明名称 ELECTROLESS NICKEL ALLOY PLATING BATH AND PROCESS FOR DEPOSITING THEREOF
摘要 <p>An aqueous nickel phosphorus tin alloy electroless plating bath and process for depositing a nickel phosphorus tin alloy onto a substrate, particularly an aluminum substrate for memory disk applications, wherein the nickel phosphorus tin alloy deposit provides enhanced thermal stability, as defined by the inhibition of crystallization and suppression of magnetization upon high temperature annealing when compared to typical NiP deposits.</p>
申请公布号 SG188351(A1) 申请公布日期 2013.04.30
申请号 SG20130015433 申请日期 2011.08.22
申请人 OMG ELECTRONIC CHEMICALS, LLC 发明人 NYE, AURORA MARIE FOJAS;DU, JERRY G.;ANDRE, ROBERT C.
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