发明名称 |
MEMS package and method for the production thereof |
摘要 |
A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate.
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申请公布号 |
US8432007(B2) |
申请公布日期 |
2013.04.30 |
申请号 |
US201113075936 |
申请日期 |
2011.03.30 |
申请人 |
LEIDL ANTON;KRUEGER HANS;STELZL ALOIS;PAHL WOLFGANG;SEITZ STEFAN;EPCOS AG |
发明人 |
LEIDL ANTON;KRUEGER HANS;STELZL ALOIS;PAHL WOLFGANG;SEITZ STEFAN |
分类号 |
H01L29/84;B81C99/00 |
主分类号 |
H01L29/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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